Bypassing a removed element in a liquid cooling system

ABSTRACT

A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve.

BACKGROUND

The present invention relates generally to the field of liquid coolingsystems and more particularly to the process of bypassing a removedcomponent in a liquid cooling system.

Liquid cooling systems are commonly utilized to cool electroniccomponents such as computer processors and memory during operation. Inliquid cooling systems, an input of cold liquid is passed over hotcomponents to dissipate the heat from the components into the coldliquid. The transfer of heat from the hot components into the coldliquid causes the temperature of the liquid to rise, and the liquid mustbe cooled before the liquid can be utilized again to cool components.Heat exchangers are often utilized to cool the liquid back down beforeit can be used to cool components again. Heat exchangers allow for someof the heat of the liquid to be dissipated into a secondary medium suchas another liquid or air. Due to the higher specific heats of commonliquids such as water, liquid cooling systems perform more effectivelyand with greater efficiency than air-based cooling systems.

SUMMARY

Embodiments of the invention disclose a system for bypassing a componentin a liquid cooling system. A source of liquid provided an input ofliquid into a liquid cooling system. The liquid from the source ofliquid flows through a check valve assembly which includes an input, afirst output, and a second output. The second output includes a checkvalve configured to open when the pressure of the liquid exceeds athreshold pressure value. A connector is attached to the first output ofthe check valve assembly. The connector is a quick connect fittingequipped with a self-sealing valve.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram depicting the components included within acheck valve assembly, in accordance with an embodiment of the invention.

FIG. 2 is a block diagram depicting a liquid cooling system whichincludes two liquid cooling components connected in series.

FIG. 3 is a block diagram depicting a liquid cooling system whichincludes two liquid cooling components connected in parallel.

FIG. 4 is a block diagram which depicts a liquid cooling system whichincludes two liquid cooling components connected in series, along withtwo check valve assemblies of FIG. 1.

FIG. 5 depicts the liquid cooling system of FIG. 4 after one of theliquid cooling components has been removed, and the flow of liquid isdiverted around the removed component by one of the check valveassemblies.

DETAILED DESCRIPTION

In general, embodiments of the present invention provide a method ofbypassing an element included within a liquid cooling system. In liquidcooling systems, it is desirable to be able to bypass an element suchthat the element can be removed without liquid leaking out of the systemand damaging any other parts or elements through contact with liquids.

In various embodiments, the element which is bypassed can be either apart which is to be cooled, such as a central processing unit (CPU), agraphics processing unit (GPU), a field-programmable gate array (FPGA),a power supply, random access memory (RAM), or any other part of acomputing device which is to be cooled using a liquid cooling system. Inother embodiments, an element which is bypassed can be a component suchas a pump, a heat exchanger, a valve, or any other component which isincluded in a liquid cooling system.

The present invention will now be described in detail with reference tothe Figures. FIG. 1 is a functional block diagram illustrating a checkvalve assembly, generally designated 100, in accordance with anembodiment of the invention. In general, check valve assembly 100automatically diverts the flow of liquid from exiting primary output 130to exiting secondary output 140 when a device connected to primaryoutput 130 is removed and an increase in the pressure of the coolingliquid occurs. In the depicted embodiment, check valve assembly 100includes assembly body 110, input 120, primary output 130, secondaryoutput 140, internal piping 150, and check valve 160.

Assembly body 110 is a body which encases the other components of checkvalve assembly 100 depicted in FIG. 1, in accordance with an embodimentof the invention. In various embodiments, assembly body 110 can becomposed of plastic, metal, or any other material capable of containingthe other components included within check valve assembly 100. In apreferred embodiment, assembly body 110 is sealed and waterproof suchthat in the event that a leak develops within check valve assembly 100,none of the liquid would be able to escape from within assembly body110. In other embodiments, such as embodiments where decreasing the sizeof check valve assembly 100 is of interest, no assembly body such asassembly body 110 is included in check valve assembly 100.

Input 120 is an interface through which liquid enters check valveassembly 100, in accordance with an embodiment of the invention. In someembodiments, input 120 is a quick-connect which allows for check valveassembly 100 to receive a flow of liquid as an input. In otherembodiments, input 120 is a pipe connection from an external componentwhich is soldered, glued, or fastened onto a terminal present withinassembly body 110 or the end of a portion of internal piping such asinternal piping 150.

In embodiments where input 120 is a quick-connect, the quick-connect isconfigured to allow for liquid cooling components such a heat exchanger,a device to be cooled, or a check valve assembly to be easily added andremoved from a liquid cooling system. In various embodiments, the quickconnects are configured to stop the flow of liquid when the liquidcooling component is removed. For example, in an embodiment where input120 is a quick-connect, the removal of check valve assembly 100 resultsin the flow of liquid into check valve assembly 100 being stopped. Ingeneral, in embodiments where the removal of a liquid cooling componentresults in the flow of liquid through the quick connect being stopped,the quick-connect includes a self-sealing valve which is configured toonly allow the flow of liquid if a component is attached to thequick-connect.

Primary output 130 is the primary output of check valve assembly 100,and is the output which connects to the next sequential component toreceive the output flow from check valve assembly 100 under normaloperating circumstances. In general, when the pressure within internalpiping 150 remains relatively low and check valve 160 is closed, theliquid output from check valve assembly 100 exits from primary output130. In the depicted embodiment, primary output 130 is depicted as beinglocated directly opposite from input 120. It should be appreciated thatthe invention is not limited to embodiments where primary output 130 islocated directly opposite from input 120, and that in other embodimentsprimary output 130 can be located anywhere within assembly body 110 orrelative to input 120.

Secondary output 140 is the secondary output of check valve assembly100, and is the output which connects to a portion of piping used tobypass a component of a liquid cooling system. In various embodiments,the flow of liquid from check valve assembly 100 exits through secondaryoutput 140 when the pressure within internal piping 150 reaches athreshold which causes check valve 160 to open. In these embodiments,secondary output 140 is the output which liquid can only reach byflowing through check valve 160.

Internal piping 150 is a portion of piping used to connect the variouscomponents included within check valve assembly 100, in accordance withan embodiment of the invention. In some embodiments, internal piping 150can be composed of a metal material such as zinc, copper, or stainlesssteel. In other embodiments, internal piping 150 is composed of aplastic material such as polyvinyl chloride (PVC). In general, anymaterial known in the art to be suitable for forming a pipe can be usedin embodiments of the invention. In a preferred embodiment, internalpiping 150 has a cross-sectional shape which is circular. However, inother embodiments, internal piping 150 can have any cross sectional areasuch that the design of internal piping 150 facilitates the flow ofliquid between two elements included in check valve assembly 100.

Check valve 160 is a valve which is configured to open and allow theflow of liquid through check valve 160 when the pressure applied to thevalve reaches a threshold value. For example, in an embodiment wherecheck valve 160 has a threshold value of 200,000 pascals (Pa), apressure of 190,000 Pa applied to check valve 160 does not result incheck valve 160 opening while a pressure of 210,000 Pa applied to checkvalve 160 results in check valve 160 opening and allowing liquid to flowthrough. In a preferred embodiment, check valve 160 is a normally-closedcheck valve, which only opens in the event that the pressure applied tothe input terminal of check valve 160 meets or exceeds the thresholdvalue. In various embodiments, any type of check valve known in the art,such as a ball check valve or a tilting disc check valve, can be used toform check valve 160.

In general, check valve 160 only permits liquid to flow in onedirection, which is indicated by the arrow depicted within check valve160. While the application of a pressure greater than the thresholdvalue allows for liquid to flow in the direction indicated by the arrow,no amount of pressure applied to check valve 160 results in the flow ofliquid in the direction opposite that indicated by the arrow withincheck valve 160.

FIG. 2 illustrates a liquid cooling environment 200, including two heatexchangers connected in series, which are utilized for dissipating heatfrom a liquid cooling system. The cooling system depicted in FIG. 2includes Source 210, external piping 215, heat exchangers 220 and 230,and drain 240. In general, liquid is intended to flow through the systemdepicted in FIG. 2 from source 210 to drain 240 (as illustrated by thearrowheads of external piping 215).

Source 210 is a source from which liquid flows before it enters heatexchangers 220 and 230. In one embodiment, source 210 is a connectionwhich carries the hot output liquid from a liquid cooling system. Inthis embodiment, the liquid which is output by source 210 may havepassed over electronic components such as CPUs or GPUs and may haveincreased in temperature before entering the liquid cooling environmentdepicted in FIG. 2.

External piping 215 are portions of piping which are used to contain theflow of liquid between the various components depicted in FIG. 2. Insome embodiments, external piping 215 can be composed of a metalmaterial such as zinc, copper, or stainless steel. In other embodiments,external piping 215 is composed of a plastic material such as polyvinylchloride (PVC). In general, any material known in the art to be suitablefor forming a pipe can be used in embodiments of the invention. In apreferred embodiment, external piping 215 has cross-sectional shapeswhich are circular. However, in other embodiments, external piping 215can have any cross sectional area such that the design of externalpiping 215 facilitates the flow of liquid between two components.

It should be appreciated that quick connects may be utilized to connectany portions of internal piping such as external piping 215 to othercomponents or devices.

Heat exchangers 220 and 230 are devices which transfer thermal energyfrom one medium to another. In the depicted embodiment, heat exchangers220 and 230 transfer heat from the liquid which is received from source210, herein referred to as “the hot liquid”, into a secondary flow ofliquid (not shown), which has a temperature lower than that of the flowof liquid which is received from source 210. In many embodiments, heatexchangers 220 and 230 operate by breaking the flow of the hot liquidinto many smaller pipes, all of which are enclosed in a tank. Once theflow of the hot liquid is split up into smaller pipes, the secondaryflow of liquid is diverted into the body of the tank such that thesecondary liquid flows through the tank and around the smaller pipes towhich the flow of the hot liquid has been diverted. In this design, thehigher surface area created by the larger number of smaller pipesresults in greater cooling speed of the hot liquid, and a greatertransfer of thermal energy between the hot liquid and the secondary flowof liquid.

In general, heat exchangers 220 and 230 can be any devices whichfacilitate transferring a portion of the thermal energy included in theflow of liquid received from source 210 into a secondary medium such asa secondary flow of liquid. In a preferred embodiment, thermal energy istransferred from the flow of liquid received from source 210 into thesecondary medium without direct contact between the liquid received fromsource 210 and the secondary medium. In other embodiments, the secondarymedium used by heat exchangers 220 and 230 is air.

Drain 240 is a connection or portion of piping which the output of heatexchangers 220 and 230 flow into after being cooled by heat exchangers220 and 230, in accordance with an embodiment of the invention. In oneembodiment, drain 240 is a portion of piping which carries the cooledoutput of heat exchangers 220 and 230 back to a liquid cooling system tobe used for cooling a computing component.

In general, connecting components such as heat exchangers 220 and 230 inseries in a liquid cooling system facilitates the cooling systemoperating with greater efficiency than connecting the components inparallel. The greater efficiency achieved by connecting components inseries as opposed to in parallel arises from the advantage of having allof the liquid in the liquid cooling system flow through both devices, asopposed to having only a portion of the liquid flow through each devicein an embodiment where components are connected in parallel. An exampleof components connected in parallel is depicted and described in greaterdetail with respect to FIG. 3.

It should be appreciated that although FIG. 2 depicts two heatexchangers being connected in series, any components of a liquid coolingsystem such as parts which are to be cooled including CPUs, GPUs, powersupplies, or RAM can be connected in series as depicted in FIG. 2 inorder to increase the efficiency of the liquid cooling system. In otherembodiments, any other liquid cooling system components such as pumps orvalves can be connected in series similarly to heat exchangers 220 and230.

FIG. 3 illustrates a liquid cooling environment, generally designated300, which includes two heat exchangers connected in parallel which areutilized for dissipating heat from a liquid cooling system. The coolingsystem depicted in FIG. 3 includes Source 310, external piping 315, heatexchangers 320 and 330, and drain 340. In general, liquid is intended toflow through the system depicted in FIG. 3 from source 310 to drain 340(as illustrated by the arrowheads of external piping 315).

Source 310 is a source from which liquid flows before it enters heatexchangers 320 and 330. In general, source 310 is substantially similarto source 210 depicted and described in greater detail with respect toFIG. 2.

External piping 315 is portions of piping which are used to contain theflow of liquid between the various components depicted in FIG. 3. Ingeneral, external piping 315 is substantially similar to external piping215 depicted and described in greater detail with respect to FIG. 2.

Heat exchangers 320 and 330 are devices which transfer thermal energyfrom the liquid which is received from source 310 into a secondarymedium such as liquid or air (not shown), in accordance with anembodiment of the invention. In general, heat exchangers 320 and 330 aresubstantially similar to heat exchangers 220 and 230 depicted anddescribed in greater detail with respect to FIG. 2.

Drain 340 is a connection or portion of piping which the output of heatexchangers 320 and 330 flow into after being cooled by heat exchangers320 and 330, in accordance with an embodiment of the invention. Ingeneral, drain 340 is substantially similar to drain 240 illustrated anddescribed in greater detail with respect to FIG. 2.

In general, FIG. 3 depicts an exemplary liquid cooling system where twoliquid cooling components are connected in parallel. In variousembodiments, connecting liquid cooling components in parallel isdesirable if there is a significant chance that a liquid coolingcomponent will be removed at some point. As opposed to a system whereliquid cooling components are connected in series, a system where liquidcooling components are connected in parallel can function when one ofthe liquid cooling components is removed. In embodiments where theperformance of the liquid cooling system is of particular importance,connecting components in series is preferred to connecting components inparallel due to the increased performance of in-series components whichresults from having all of the liquid in the liquid cooling system flowthrough each component.

FIG. 4 illustrates a liquid cooling system, generally designated 400,which includes two heat exchangers connected in series with check valveassemblies, in accordance with an embodiment of the invention. Liquidcooling system 400 of FIG. 4 includes source 410, external piping 415,check valve assemblies 420 and 440, heat exchangers 430 and 450, anddrain 460.

Source 410 is a source from which liquid flows before it enters heatexchangers 420 and 440. In general, source 410 is substantially similarto source 210 depicted and described in greater detail with respect toFIG. 2.

External piping 415 are portions of piping which are used to contain theflow of liquid between the various components depicted in FIG. 3. Ingeneral, external piping 415 is substantially similar to external piping215 depicted and described in greater detail with respect to FIG. 2.

Check valve assemblies 420 and 440 are components which, in the eventthat a component is removed from a liquid cooling system, facilitatediverting the flow of liquid around the missing component. In general,check valve assemblies 420 and 440 are substantially similar to checkvalve assembly 100 depicted and described in greater detail with respectto FIG. 1.

Heat exchangers 430 and 450 are devices which transfer thermal energyfrom the liquid which is received from source 410 into a secondarymedium such as liquid or air (not shown), in accordance with anembodiment of the invention. In general, heat exchangers 430 and 450 aresubstantially similar to heat exchangers 220 and 230 depicted anddescribed in greater detail with respect to FIG. 2.

Drain 460 is a connection or portion of piping which the output of heatexchangers 430 and 450 flow into after being cooled by heat exchangers430 and 450, in accordance with an embodiment of the invention. Ingeneral, drain 460 is substantially similar to drain 240 illustrated anddescribed in greater detail with respect to FIG. 2.

In some embodiments, check valve assembly 440 is configured to divertliquid (i.e., open the check valve of check valve assembly 440) at alower pressure value than check valve assembly 420. In general, as checkvalve assembly is further away from source 410, the pressure requiredfor check valve assemblies 440 to divert liquid is less than thepressure for check valve assembly 420 to divert liquid to ensure thatboth check valves do not open in embodiments, such as the embodimentdepicted in FIG. 5, where heat exchanger 450 is removed.

FIG. 5 illustrates the liquid cooling system 400 of FIG. 4 after heatexchanger 450 has been removed, in accordance with an embodiment of theinvention.

Quick connects 510 are connectors which are configured to allow forliquid cooling system components such as heat exchanger 450 to be easilyadded and removed from a liquid cooling system. In various embodiments,quick connects 510 are configured to stop the flow of liquid when heatexchanger 450 is removed. For example, in the embodiment depicted inFIG. 5, heat exchanger 450 has been removed, and as a result, both quickconnects 510 are closed and do not allow liquid to flow out of the endsof internal piping 415.

As a result of the closure of quick connects 510, liquid is no longerable to flow from source 410 to drain 460, and hydrostatic pressurebuilds up in the system. It should be appreciated that the amount ofhydrostatic pressure which builds up in the system is determined by theproperties of source 410 or another device such as a liquid pump whichcontrols how liquid enters liquid cooling environment 400.

The buildup of hydrostatic pressure within external piping 415 causesthe check valve within check valve assembly 440 to open, allowing liquidto bypass the component removed from quick connects 510.

In this embodiment, it is desirable that the pressure which is requiredfor the check valve within check valve assembly 440 to open beconfigured to at a lower pressure than the check valve within checkvalve assembly 420. In embodiments which include multiple check valveassemblies connected in series, it is desirable that the pressurerequired to open each successive check valve decreases, with respect tothe direction of the flow of liquid within the liquid cooling system.

In general, when a component such as a heat exchanger is removed fromliquid cooling system 400, hydrostatic pressure builds uniformly up inthe system within the region between source 410 and the first quickconnect 510 adjacent to the removed component. As a result, it isdesirable that the check valve within the check valve assembly nearestto the removed component open first, and allow for the pressure to bereduced to avoid all of the check vales opening and bypassing otherliquid cooling components which have not been removed. For example, inthe embodiment depicted in FIG. 5, it is desirable that if a liquidcooling component is removed from quick connects 510, then the checkvalve included within check valve assembly 440 opens while the checkvalve within check valve assembly 420 does not open.

What is claimed is:
 1. A system for bypassing a component in a liquidcooling system, the system comprising: a source of liquid; a check valveassembly comprising an input, a first output, and a second output,wherein the second output includes a check valve configured to openresponsive to the pressure of the liquid exceeding a threshold pressurevalue; and a connector attached to the first output of the check valveassembly, wherein the connector is a quick connect fitting equipped witha self-sealing valve.
 2. The method of claim 1, wherein the connector isoperably compatible with an input to a liquid cooling component.
 3. Thesystem of claim 1, further comprising: one or more pipes connecting thesource of liquid to the input of the check valve assembly; and one ormore pipes connecting the first output to an input to a liquid coolingcomponent.
 4. The system of claim 3, further comprising one or morepipes connecting the second output to a destination that bypasses theliquid cooling component.
 5. The system of claim 1, wherein the sourceof liquid comprises an input of liquid pressurized at a first pressure.6. The system of claim 5, wherein the first pressure is greater than thethreshold pressure.
 7. The system of claim 1, wherein the liquid coolingcomponent comprises a heat exchanger.
 8. The system of claim 1, whereinthe liquid cooling component comprises a device which is cooled by theliquid cooling system.
 9. The system of claim 8, wherein the devicewhich is cooled by the liquid cooling system comprises a centralprocessing unit (CPU).
 10. The system of claim 8, wherein the devicewhich is cooled by the liquid cooling system comprises a graphicsprocessing unit (GPU).
 11. The system of claim 8, wherein the devicewhich is cooled by the liquid cooling system comprises afield-programmable gate array (FPGA).
 12. The system of claim 8, whereinthe device which is cooled by the liquid cooling system comprises randomaccess memory (RAM).